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Wafer wax attachment device - List of Manufacturers, Suppliers, Companies and Products

Wafer wax attachment device Product List

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4-inch compatible wafer wax application device 'TEC-1006ZR'

4-inch compatible wafer wax application device 'TEC-1006ZR'

Automate the process of attaching multiple wafers to ceramic plates!

The "TEC-1006ZR" is a wafer wax application device compatible with 4-inch wafers. It achieves stabilization of the flatness of wafer attachment. It can accommodate multiple wafers. It can attach a maximum of 10 pieces for 2-inch wafers, 5 pieces for 3-inch wafers, and 3 pieces for 4-inch wafers. 【Features】 - Achieves stabilization of the flatness of wafer attachment (our record: 2.5um) - Capable of handling multiple wafers - Supports a variety of recipes including heating, wax application, pressing, and cooling - Achieves high throughput through optimization of conditions (our record: 2-inch x 8 wafers = within 15 minutes) *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment

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12-inch compatible wafer wax application device 'TEC-1001MB'

12-inch compatible wafer wax application device 'TEC-1001MB'

We can accommodate various workpieces, including compound semiconductor wafers!

The "TEC-1001MB" is a dedicated device for wafer wax application that achieves high-quality grinding and polishing processes. It allows for the setting of pressure, temperature, and time conditions according to the characteristics of the wafer, minimizing damage to the device. By optimizing the heating and cooling mechanisms and employing a highly rigid structural design, it ensures uniform temperature distribution and stable load distribution, preventing the occurrence of wax thickness variation that can affect precision. 【Features】 ■ Allows for setting pressure, temperature, and time conditions according to wafer characteristics ■ Minimizes damage to the device ■ Achieves uniform temperature distribution and stable load distribution ■ Prevents the occurrence of wax thickness variation that affects precision ■ Compatible with 12-inch wafers *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment
  • Other semiconductors

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Wafer bonding device prevents uneven wax thickness!

Wafer bonding device prevents uneven wax thickness!

A bonding device for compound semiconductor wafers, etc. It is a dedicated device for wafer waxing that achieves high-quality grinding and polishing.

By optimizing the heating and cooling mechanisms and employing a high-rigidity machine design, we achieve a uniform temperature distribution and stable load distribution, preventing the occurrence of wax thickness variations that can negatively impact precision. 【Features】 ■ Pressure, temperature, and time conditions can be set according to the characteristics of the wafer ■ Damage to the device is minimized ■ Achieves uniform temperature distribution and stable load distribution ■ Prevents the occurrence of wax thickness variations that affect precision ■ Compatible with 12-inch wafers *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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